Final Report for Grant DE-FG02-97ER45655.

Wynblatt, P.

Technical Information Center Oak Ridge Tennessee

关键词: Au alloys;    Graphite;    Interfacial adhesion;    Lead nickel alloys;    Metallization;   

RP-ID  :  DE2003808743

学科分类：工程和技术（综合）

美国|英语

来源: National Technical Reports Library

【 摘 要 】

Studies were performed of the Au/SiC interface, as well as the interfaces between Sic and several Au alloys. (The Au/SiC system is potentially interesting for the metallization of semiconductor Sic). High quality micro-crystals of pure Au were prepared on the surface of 6H-Sic. A contact angle of 133 degrees plus or minus one degree for pure Au on Sic was obtained after equilibration at 800 degrees C. Three elements were identified as having potential to segregate to the Au-Sic interfaces thereby increasing interfacial adhesion: Sn, Ge and Si.