NASA Electronic Parts and Packaging (NEPP) Program Status and Technology Investments Overview

Majewicz, Peter ; Pellish, Jonathan ; Sampson, Michael

关键词: NASA PROGRAMS;    ELECTRONICS;    ELECTRONIC PACKAGING;    PROJECT PLANNING;    PROJECT MANAGEMENT;    INVESTMENTS;    TECHNOLOGY ASSESSMENT;    ASSURANCE;   

RP-ID  :  GSFC-E-DAA-TN70018

美国|英语

来源: NASA Technical Reports Server

【 摘 要 】

The presentation provides an updated, high-level overview of the NEPP Program. The latest organizational chart is presented that shows the names of the Program and Assistant Program Managers. Additionally, the recent work that is on-going with the updating of several NASA NPDs, NPRs and technical standards is reviewed. Internal and external organizational interfaces are described. Finally, the current technology focus areas are described. These areas include passives, wide-band gap power devices, processor units (CPUs and GPUs), 2.5D and 3D device architectures, memories, and data analytics.