Advancement in thermal interface materials for future high-performance electronic applications. Part 1.

Jakaboski, Blake Elaine ; Wong, Chung-Nin Channy ; Huber, Dale L. ; Rightley, Michael J. ; Emerson, John Allen

Sandia National Laboratories

关键词: Heat Transfer;    Adhesives;    Thermal Conductivity;    Electric Conductivity.;    Thermal Conductivity.;   

DOI  :  10.2172/902216
RP-ID  :  SAND2007-0417
RP-ID  :  AC04-94AL85000
RP-ID  :  902216

美国|英语

来源: UNT Digital Library

【 摘 要 】

As electronic assemblies become more compact and increase in processing bandwidth, escalating thermal energy has become more difficult to manage. The major limitation has been nonmetallic joining using poor thermal interface materials (TIM). The interfacial, versus bulk, thermal conductivity of an adhesive is the major loss mechanism and normally accounts for an order magnitude loss in conductivity per equivalent thickness. The next generation TIM requires a sophisticated understanding of material and surface sciences, heat transport at submicron scales, and the manufacturing processes used in packaging of microelectronics and other target applications. Only when this relationship between bond line manufacturing processes, structure, and contact resistance is well-understood on a fundamental level will it be possible to advance the development of miniaturized microsystems. This report examines using thermal and squeeze-flow modeling as approaches to formulate TIMs incorporating nanoscience concepts. Understanding the thermal behavior of bond lines allows focus on the interfacial contact region. In addition, careful study of the thermal transport across these interfaces provides greatly augmented heat transfer paths and allows the formulation of very high resistance interfaces for total thermal isolation of circuits. For example, this will allow the integration of systems that exhibit multiple operational temperatures, such as cryogenically cooled detectors.