Electrical properties of REF308, REF320, EF-AR20, and RSF200 foam encapsulants.

Russick, Edward Mark

Sandia National Laboratories

关键词: Encapsulation-Materials-Testing.;    Electromechanical Devices.;    Breakdown;    Dielectric Materials;    Polymers;   

DOI  :  10.2172/883468
RP-ID  :  SAND2006-0134
RP-ID  :  AC04-94AL85000
RP-ID  :  883468

美国|英语

来源: UNT Digital Library

【 摘 要 】

Foam encapsulants are used to encapsulate electromechanical assemblies for reasons such as shock mitigation, structural support, and voltage breakdown protection. Characterization of electrical properties of polymer encapsulants is important in situations where potting materials are in intimate contact with electrical components (e.g., printed wiring boards). REF308, REF320, RSF200, and EF-AR20 foams were developed for encapsulation in some potting applications at Sandia. Select electrical properties were measured for these Sandia encapsulants to characterize them for use in electromechanical potting applications. Dielectric constant with dissipation factors, volume resistivity, and dielectric strength were measured for REF308, REF320, RSF200, and EF-AR20 encapsulants. Fabrication of foam test specimens and the electrical test procedures will be discussed, and electrical testing results will be reported.