Recombination Parameters in InGaAsSb Epitaxial Layers for Thermophotovoltaic Applications | |
Kumar, R.J. ; Gutmann, J.J. ; Borrego, J.M. ; Dutta, P.S. ; Wang, C.A. ; Martinelli, R.U. ; Nichols, G. | |
Lockheed Martin | |
关键词: Velocity; 42 Engineering; Recombination; Simulation; | |
DOI : 10.2172/821373 RP-ID : LM-03K035 RP-ID : AC12-00SN39357 RP-ID : 821373 |
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美国|英语 | |
来源: UNT Digital Library | |
【 摘 要 】
Radio-frequency (RF) photoreflectance measurements and one-dimensional device simulations have been used to evaluate bulk recombination parameter and surface recombination velocity (SRV) in doubly-capped 0.55 eV, 2 x 10{sup 17} cm{sup -3} doped p-InGaAsSb epitaxial layers for thermophotovoltaic (TPV) applications. Bulk lifetimes of 90-100 ns and SRVs of 680 cm/s to 3200 cm/s (depending on the capping layer) are obtained, with higher doping and higher bandgap capping layers most effective in reducing SRV. RF photoreflectance measurements and one-dimensional device simulations are compatible with a radiative recombination coefficient (B) of 3 x 10{sup -11} cm{sup 3}/s and Auger coefficient (C) of 1 x 10{sup -28} cm{sup 6}/s.
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