MCM-C Multichip Module Manufacturing Guide

Blazek, R.J. ; Kautz, D.R. ; Galichia, J.V.

Kansas City Plant (U.S.)

关键词: Classification;    32 Energy Conservation, Consumption, And Utilization;    Microelectronics;    42 Engineering;    Packaging;   

DOI  :  10.2172/768060
RP-ID  :  KCP-613-6384
RP-ID  :  AC04-76DP00613
RP-ID  :  768060

美国|英语

来源: UNT Digital Library

【 摘 要 】

Honeywell Federal Manufacturing & Technologies (FM&T) provides complete microcircuit capabilities from design layout through manufacturing and final electrical testing. Manufacturing and testing capabilities include design layout, electrical and mechanical computer simulation and modeling, circuit analysis, component analysis, network fabrication, microelectronic assembly, electrical tester design, electrical testing, materials analysis, and environmental evaluation. This document provides manufacturing guidelines for multichip module-ceramic (MCM-C) microcircuits. Figure 1 illustrates an example MCM-C configuration with the parts and processes that are available. The MCM-C technology is used to manufacture microcircuits for electronic systems that require increased performance, reduced volume, and higher density that cannot be achieved by the standard hybrid microcircuit or printed wiring board technologies. The guidelines focus on the manufacturability issues that must be considered for low-temperature cofired ceramic (LTCC) network fabrication and MCM assembly and the impact that process capabilities have on the overall MCM design layout and product yield. Prerequisites that are necessary to initiate the MCM design layout include electrical, mechanical, and environmental requirements. Customer design data can be accepted in many standard electronic file formats. Other requirements include schedule, quantity, cost, classification, and quality level. Design considerations include electrical, network, packaging, and producibility; and deliverables include finished product, drawings, documentation, and electronic files.