Development of New Low-Cost, High-Performance, PV Module Encapsulant/Packaging Materials: Final Technical Progress Report, 22 October 2002 - 15 November 2007

Tucker, R.

关键词: MANUFACTURERS;    PACKAGING;    PROGRESS REPORT;    THIN FILMS PV;    CRYSTALLINE SILICON;    AMORPHOUS SILICON;    COPPER INDIUM DISELENIDE (CIS);    MANUFACTURER;    MODULE;    THIN-FILM;    SOLAR CELL;    LOW COST;    HIGH PERFORMANCE;    ENCAPSULANT/PACKAGING MATERIALS;    QUALIFICATION;    Solar Energy - Photovoltaics;   

DOI  :  10.2172/927487
RP-ID  :  NREL/SR-520-43019
PID  :  OSTI ID: 927487
Others  :  Other: ZDO-2-30628-10
Others  :  TRN: US200816%%672

美国|英语

来源: SciTech Connect

【 摘 要 】

Report on objectives to work with U.S.-based PV module manufacturers (c-Si, a-Si, CIS, other thin films) to develop/qualify new low-cost, high-performance PV module encapsulant/packaging materials, and processes using the packaging materials.