Microfabricated wire arrays for Z-pinch.

Spahn, Olga Blum ; Rowen, Adam M. ; Cich, Michael Joseph ; Peake, Gregory Merwin ; Arrington, Christian L. ; Nash, Thomas J. ; Klem, John Frederick ; Romero, Dustin Heinz

关键词: LINEAR Z PINCH DEVICES;    WIRES;    FABRICATION;    GALLIUM ARSENIDES;    ALUMINIUM ARSENIDES;    GOLD;    ELECTROPLATING;    COPPER;    PLATINUM;    PLATING;    MINIATURIZATION Wire;    Plating.;    Copper plating.;    Fabrication;   

DOI  :  10.2172/945909
RP-ID  :  SAND2008-6088
PID  :  OSTI ID: 945909
Others  :  TRN: US0901184

美国|英语

来源: SciTech Connect

【 摘 要 】

Microfabrication methods have been applied to the fabrication of wire arrays suitable for use in Z. Self-curling GaAs/AlGaAs supports were fabricated as an initial route to make small wire arrays (4mm diameter). A strain relief structure that could be integrated with the wire was designed to allow displacements of the anode/cathode connections in Z. Electroplated gold wire arrays with integrated anode/cathode bus connections were found to be sufficiently robust to allow direct handling. Platinum and copper plating processes were also investigated. A process to fabricate wire arrays on any substrate with wire thickness up to 35 microns was developed. Methods to handle and mount these arrays were developed. Fabrication of wire arrays of 20mm diameter was demonstrated, and the path to 40mm array fabrication is clear. With some final investment to show array mounting into Z hardware, the entire process to produce a microfabricated wire array will have been demonstrated.