科技报告详细信息
Modeling Enclosure Design in Above-Grade Walls
Lstiburek, J.1  Ueno, K.1  Musunuru, S.1 
[1] Building Science Corporation, Westford, MA (United States)
关键词: residential;    residential buildings;    building america;    bsc;    enclosure design;    modeling;    above-grade walls;   
DOI  :  10.2172/1245345
RP-ID  :  DOE/GO--102016-4838
PID  :  OSTI ID: 1245345
Others  :  Other: 7373
学科分类:能源(综合)
美国|英语
来源: SciTech Connect
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【 摘 要 】

Building Science Corporation modeled typically well-performing wall assemblies using W?��rme und Feuchte instation?��r (WUFI) Version 5.3 software and demonstrated that these models agree with historic experience when calibrated and modeled correctly. This technical report provides a library of WUFI modeling input data and results. Within the limits of existing experience, this information can be generalized for applications to a broad population of houses.

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