科技报告详细信息
Modeling Enclosure Design in Above-Grade Walls | |
Lstiburek, J.1  Ueno, K.1  Musunuru, S.1  | |
[1] Building Science Corporation, Westford, MA (United States) | |
关键词: residential; residential buildings; building america; bsc; enclosure design; modeling; above-grade walls; | |
DOI : 10.2172/1245345 RP-ID : DOE/GO--102016-4838 PID : OSTI ID: 1245345 Others : Other: 7373 |
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学科分类:能源(综合) | |
美国|英语 | |
来源: SciTech Connect | |
【 摘 要 】
Building Science Corporation modeled typically well-performing wall assemblies using W?��rme und Feuchte instation?��r (WUFI) Version 5.3 software and demonstrated that these models agree with historic experience when calibrated and modeled correctly. This technical report provides a library of WUFI modeling input data and results. Within the limits of existing experience, this information can be generalized for applications to a broad population of houses.
【 预 览 】
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41942KB | download |