Plane-strain discrete dislocation plasticity incorporating anisotropic elasticity

INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES

卷:48

Article

Shishvan, Siamak Soleymani^2,3  Mohammadi, Soheil³  Rahimian, Mohammad³  Van der Giessen, Erik¹ 

[1] Univ Groningen, Dept Appl Phys, Zernike Inst Adv Mat, NL-9747 AG Groningen, Netherlands

[2] Univ Tabriz, Fac Civil Engn, Tabriz, Iran

[3] Univ Tehran, Sch Civil Engn, Dept Struct Engn, Tehran, Iran

关键词: Discrete dislocation plasticity (DDP);    Anisotropic elasticity;    Size effects;    Thin films;   

DOI  :  10.1016/j.ijsolstr.2010.10.010

来源: Elsevier

【 摘 要 】

The increasing application of plane-strain testing at the (sub-) micron length scale of materials that comprise elastically anisotropic cubic crystals has motivated the development of an anisotropic two-dimensional discrete dislocation plasticity (2D DDP) method. The method relies on the observation that plane-strain plastic deformation of cubic crystals is possible in specific orientations when described in terms of edge dislocations on three effective slip systems. The displacement and stress fields of such dislocations in an unbounded anisotropic crystal are recapitulated, and we propose modified constitutive rules for the discrete dislocation dynamics of anisotropic single crystals. Subsequently, to handle polycrystalline problems, we follow an idea of O'Day and Curtin (J. Appl. Mech. 71 (2004) 805-815) and treat each grain as a plastic domain, and adopt superposition to determine the overall response. This method allows for a computationally efficient analysis of micro-scale size effects. As an application, we study freestanding thin copper films under plane-strain tension. First, the computational framework is validated for the special case of isotropic thin films modeled by means of a standard 2D DDP method. Next, predictions of size dependent plastic behavior in anisotropic columnar-grained thin films with varying thickness/grain size are presented and compared with the isotropic results. (C) 2010 Elsevier Ltd. All rights reserved.

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