Computation of thermal fracture parameters for orthotropic functionally graded materials using Jk-integral

INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES

卷:47

Article

Dag, Serkan¹  Arman, E. Erhan¹  Yildirim, Bora² 

[1] Middle E Tech Univ, Dept Mech Engn, TR-06531 Ankara, Turkey

[2] Hacettepe Univ, Dept Mech Engn, TR-06800 Ankara, Turkey

关键词: Orthotropic functionally graded materials;    J(k)-integral;    Finite element method;    Thermal stresses;    Stress intensity factors;   

DOI  :  10.1016/j.ijsolstr.2010.08.023

来源: Elsevier

【 摘 要 】

This article introduces a computational method based on the J(k)-integral for mixed-mode fracture analysis of orthotropic functionally graded materials (FGMs) that are subjected to thermal stresses. The generalized definition of the J(k)-integral is recast into a domain independent form composed of line and area integrals by utilizing the constitutive relations of plane orthotropic thermoelasticity. Implementation of the domain independent Jk-integral is realized through a numerical procedure developed by means of the finite element method. The outlined computational approach enables the evaluation of the modes I and II stress intensity factors, the energy release rate, and the T-stress. The developed technique is validated numerically by considering two different problems, the first of which is the problem of an embedded crack in an orthotropic FGM layer subjected to steady-state thermal stresses: and the second one is that of periodic cracks under transient thermal loading. Comparisons of the mixed-mode stress intensity factors evaluated by the J(k)-integral based method to those calculated through the displacement correlation technique (DCT) and to those available in the literature point out that, the proposed form of the J(k)-integral possesses the required domain independence and leads to numerical results of high accuracy. Further results are presented to illustrate the influences of the geometric and material constants on the thermal fracture parameters. (C) 2010 Elsevier Ltd. All rights reserved.

【 授权许可】

Free