Dislocation emission and crack propagation during thin film buckling on substrate

INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES

卷:185

Article

Bertin, Benjamin¹  Durinck, Julien¹  Colin, Jerome¹ 

[1] Univ Poitiers, Inst Pprime, SP2MI Teleport 2, F-86962 Futuroscope, France

关键词: Buckling failure;    Delamination;    Crack;    Dislocations;    Modelling;    Plasticity;   

DOI  :  10.1016/j.ijsolstr.2019.07.025

来源: Elsevier

【 摘 要 】

The buckling of a gold thin film deposited on a rigid substrate has been numerically investigated by means of static molecular dynamics simulations. Three different regimes of deformation have been identified depending on the values of the adhesion energy of the film on its substrate (Gamma(int)). For low adhesion energy, the buckling and gliding through dislocation emission into the interface have been observed. For intermediate values of Gamma(int), the dissociation of the interfacial dislocations into the film leads to the formation of a Lomer-Cottrell lock that stops the buckle extension, promoting thus the propagation of a crack accompanied by the emission of dislocations. It results in the formation of a twin. For large values of Gamma(int,) the kinking of the interfacial crack has been evidenced along with dislocation nucleation at its tip leading to twins again. Finally, the different evolutions of the film have been summarized in a behavior diagram displayed in the plane of applied strain and adhesion energy variables. (C) 2019 Elsevier Ltd. All rights reserved.

【 授权许可】

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