Determination of the interface properties in an elastic film/substrate system

INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES

卷:191

Article

Yin, H. B.^1,4  Liang, L. H.²  Wei, Y. G.³  Peng, Z. L.^1,4  Chen, S. H.^1,4 

[1] Beijing Inst Technol, Inst Adv Struct Technol, Beijing 100081, Peoples R China

[2] Beijing Univ Chem Technol, Coll Mech & Elect Engn, Beijing 100029, Peoples R China

[3] Peking Univ, Coll Engn, Beijing 100871, Peoples R China

[4] Beijing Inst Technol, Beijing Key Lab Lightweight Multifunct Composite, Beijing 100081, Peoples R China

关键词: Film-substrate system;    Interface cohesive zone;    Peeling test;    Interface strength;    Interface toughness;   

DOI  :  10.1016/j.ijsolstr.2020.01.003

来源: Elsevier

【 摘 要 】

Based on the assumption of constant-stress (Dugdale) interface bonding, a theoretical model is established in order to characterize the entire peeling response of an elastic film from a rigid substrate. The relationship between the peeling force and the peeling displacement and the relationship between the cohesive zone length and the peeling displacement at different peeling stages are analyzed. Closed-form solutions of the maximum peeling force and the maximum length of cohesive zone are further derived theoretically. It is found that both the maximum peeling force and the maximum length of cohesive zone depend on the interface strength, interface toughness and bending stiffness of the film. Combined with the classical Kendall's model, the cohesive zone length in the steady-state peeling stage is further given. A new method to simultaneously determine the interface strength and interface toughness is proposed, as long as the maximum peeling force, steady-state peeling force and film's bending stiffness are obtained from peeling tests. The results of this paper should be very helpful for interface performance prediction and interface design of film/substrate systems. (C) 2020 Elsevier Ltd. All rights reserved.

【 授权许可】

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