期刊论文详细信息
JOURNAL OF COMPUTATIONAL AND APPLIED MATHEMATICS 卷:236
Evaluation of mechanical parameters of an elastic thin film system by modeling and numerical simulation of telephone cord buckles
Article; Proceedings Paper
Li, Zhiping1 
[1] Beijing Univ, LMAM, Beijing 100871, Peoples R China
关键词: Telephone cord buckles;    Elastic thin film;    Initial residual stress;    Interface toughness;    Von Karman plate equations;    Chebyshev collocation method;   
DOI  :  10.1016/j.cam.2011.05.018
来源: Elsevier
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【 摘 要 】

The morphology of telephone cord buckles of elastic thin films can be used to evaluate the initial residual stress and interface toughness of the film-substrate system. The maximum out-of-plane displacement delta, the wavelength lambda and amplitude A of the wave buckles can be measured in physical experiments. Through delta, lambda, and A, the buckle morphology is obtained by an annular sector model established using the von Karman plate equations in polar coordinates for the elastic thin film. The mode-mix fracture criterion is applied to determine the shape and scale parameters. A numerical algorithm combining the Newmark-beta scheme and the Chebyshev collocation method is adopted to numerically solve the problem in a quasi-dynamic process. Numerical experiments show that the numerical results agree well with physical experiments. (C) 2011 Elsevier B.V. All rights reserved.

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