Strength and ductility of bulk Cu/Nb nanolaminates exposed to extremely high temperatures

SCRIPTA MATERIALIA

卷:166

Article

Yang, Wenfan^1,2  Beyerlein, Irene J.³  Jin, Qianqian^1,2  Ge, Hualong^1,2  Xiong, Ting^1,2  Yang, Lixin^1,2  Pang, Jianchao^1,2  Zhou, Yangtao^1,2  Shao, Xiaohong^1,2  Zhang, Bo^1,2  Zheng, Shijian^1,4,5  Ma, Xiuliang^1,2,6 

[1] Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, 72 Wenhua Rd, Shenyang 110016, Liaoning, Peoples R China

[2] Univ Sci & Technol China, Sch Mat Sci & Engn, Hefei 230026, Anhui, Peoples R China

[3] Univ Calif Santa Barbara, Dept Mech Engn, Dept Mat, Santa Barbara, CA 93106 USA

[4] Hebei Univ Technol, Res Inst Energy Equipment Mat, Sch Mat Sci & Engn, Tianjin 300130, Peoples R China

[5] Hebei Univ Technol, Tianjin Key Lab Mat Laminating Fabricat & Interfa, Tianjin 300130, Peoples R China

[6] Lanzhou Univ Technol, Sch Mat Sci & Engn, Lanzhou 730050, Gansu, Peoples R China

关键词: Cu-Nb;    Interface;    Strength;    Thermal stability;    Hall-Petch relation;   

DOI  :  10.1016/j.scriptamat.2019.03.007

来源: Elsevier

【 摘 要 】

In this work, we investigate the tensile strength and ductility of bulk Cu/Nb nanolaminates after exposure to high temperatures. We show that the interface transforms from flat to wavy at a transition temperature of 700 degrees C, and tensile strength is linearly proportional to H-1/2 (H = layer thickness). Moreover, the wavy interfaces give rise to a higher slope of the Hall-Petch law. This result can be attributed to greater resistance to slip transmission across wavy interfaces compared to planar interfaces. After 1000 degrees C for 1 h, the material still exhibits a high strength of 468 MPa and enhanced elongation. (C) 2019 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

【 授权许可】

Free