Evidence of 3D strain gradients associated with tin whisker growth

SCRIPTA MATERIALIA

卷:144

Article

Hektor, Johan¹  Marijon, Jean-Baptiste²  Ristinmaa, Matti¹  Hall, Stephen A.¹  Hallberg, Hakan¹  Iyengar, Srinivasan³  Micha, Jean-Sebastien^4,5,6,7  Robach, Odile^4,8,9  Grennerat, Fanny¹⁰  Castelnau, Olivier² 

[1] Lund Univ, Div Solid Mech, Box 118, S-22100 Lund, Sweden

[2] Arts & Metiers ParisTech CNAM, UMR CNRS 8006, Lab PiMM, Paris, France

[3] Lund Univ, Div Mat Engn, Box 118, S-22100 Lund, Sweden

[4] ESRF, CEA CNRS CRG IF Beamline BM32, Grenoble, France

[5] Univ Grenoble Alpes, INAC SPrAM, Grenoble, France

[6] Univ Grenoble Alpes, CNRS, SPrAM, Grenoble, France

[7] Univ Grenoble Alpes, CEA, INAC SPrAM, PCI, Grenoble, France

[8] Univ Grenoble Alpes, INAC SP2M, INAC-SP2M Grenoble, France

[9] Univ Grenoble Alpes, INAC SP2M, CEA, NRS, INAC-SP2M Grenoble, France

[10] LGT Argouges, Educ Natl, Grenoble, France

关键词: Whiskers;    Intermetallic compounds;    Lead-free solder;    X-ray diffraction;   

DOI  :  10.1016/j.scriptamat.2017.09.030

来源: Elsevier

【 摘 要 】

We have used Differential Aperture X-ray Microscopy (DAXM) to measure grain orientations and deviatoric elastic strains in 3D around a tin whisker. The results show strain gradients through the depth of the tin coating, revealing a higher strain deeper in the Sn layer. These higher strains are explained by the volume change occurring during growth of the intermetallic phase Cu6Sn5 at the interface between the Cu substrate and the Sn coating and at grain boundaries between Sn grains. (C) 2017 Acta Materialia Inc. Published by Elsevier Ltd.

【 授权许可】

Free