Formation of Sn dendrites and SnAg eutectics in a SnAgCu solder

SCRIPTA MATERIALIA

卷:61

Article

Gong, Jicheng¹  Liu, Changqing²  Conway, Paul P.²  Silberschmidt, Vadim V.² 

[1] Univ Oxford, Dept Mat, Oxford OX1 3PH, England

[2] Univ Loughborough, Wolfson Sch Mech & Mfg Engn, Loughborough LE11 3TU, Leics, England

关键词: Soldering;    Eutectic solidification;    Dendrite growths;    Intermetallics;   

DOI  :  10.1016/j.scriptamat.2009.05.034

来源: Elsevier

【 摘 要 】

The formation behaviour of grains and their components, including Sn dendrites, Cu(6)Sn(5) and Ag(3)Sn intermetallic compounds (IMCs), in a SnAgCu alloy is investigated in an experiment in which it was possible to obtain the solid reactants directly from the liquid solder during the liquid-solid phase transformation. The results show that Cu(6)Sn(5) IMCs are formed first in a grain; then large Sn dendrites; fibre-like Ag(3)Sn IMCs are formed ahead of the beta-Sn matrix in the coupling process, generating eutectics. (C) 2009 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

【 授权许可】

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