Surface processing using water cluster ion beams

NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS

卷:307

Article; Proceedings Paper

Takaoka, Gikan H.¹  Ryuto, Hiromichi¹  Takeuchi, Mitsuaki¹  Ichihashi, Gaku¹ 

[1] Kyoto Univ, Photon & Elect Sci & Engn Ctr, Nishikyo Ku, Kyoto 6158510, Japan

关键词: Water cluster;    Ion beam processing;    Surface reaction;    Sputtering;   

DOI  :  10.1016/j.nimb.2012.11.070

来源: Elsevier

【 摘 要 】

Vaporized water clusters were produced by an adiabatic expansion phenomenon, and various substrates such as Si(100), SiO2, polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), and polycarbonate (PC) were irradiated by water cluster ion beams. The sputtered depth increased with increasing acceleration voltage, and the sputtering rate was much larger than that obtained using Ar monomer ion irradiation. The sputtering yield for PMMA was approximately 200 molecules per ion, at an acceleration voltage of 9 kV. X-ray photoelectron spectroscopy (XPS) measurements showed that high-rate sputtering for the PMMA surface can be ascribed to the surface erosion by the water cluster ion irradiation. Furthermore, the micropatterning was demonstrated on the PMMA substrate. Thus, the surface irradiation by water cluster ion beams exhibited a chemical reaction based on OH radicals, as well as excited hydrogen atoms, which resulted in a high sputtering rate and low irradiation damage of the substrate surfaces. (C) 2013 Elsevier B.V. All rights reserved.

【 授权许可】

Free