Ultra-low dielectric properties of porous polyimide thin films fabricated by using the two kinds of templates with different particle sizes

POLYMER

卷:212

Article

Kourakata, Yumi¹  Onodera, Tsunenobu¹  Kasai, Hitoshi¹  Jinnai, Hiroshi¹  Oikawa, Hidetoshi^1,2 

[1] Tohoku Univ, Inst Multidisciplinary Res Adv Mat IMRAM, Aoba Ku, Katahira 2-1-1, Sendai, Miyagi 9808755, Japan

[2] Tohoku Univ, Sendai, Miyagi, Japan

关键词: Polyimide;    Polyamic acid;    Silica microparticles;    Porous structure;    Electron tomography;    Porosity;    Dielectric constant;    Bruggeman model;   

DOI  :  10.1016/j.polymer.2020.123115

来源: Elsevier

【 摘 要 】

Porous polyimide (PI) thin films have been fabricated successfully by using silica microparticles (MPs) with different particle sizes as a template, and the three dimensional porous structure has been observed clearly by mean of transmission electron microtomography. The measured values of dielectric constant (epsilon) decreased remarkably by introducing a porous structure, compared with ordinary PI thin films. Especially, the porosity evidently increased (ca. 10%) by suitably employing silica MPs having different particle sizes, and then the value of c was further reduced. Bruggeman model could reproduce nearly the relationship between the value of c and porosity.

【 授权许可】

Free