期刊论文详细信息
Tekhnologiya i Konstruirovanie v Elektronnoi Apparature
Stabilization of bonding force during ultrasonic wire and ribbon bonding
Petuhov I. B.1 
[1] Republic of Belarus, Minsk, OCJC "Planar-SO";
关键词: ultrasonic bond head;    bonding force;    current stabilization in wire coil;    ultrasonic transducer;    ultrasonic transducer mount;    flat-parallel plates;   
DOI  :  10.15222/TKEA2021.1-2.49
来源: DOAJ
【 授权许可】

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