期刊论文详细信息
| Tekhnologiya i Konstruirovanie v Elektronnoi Apparature | |
| Stabilization of bonding force during ultrasonic wire and ribbon bonding | |
| Petuhov I. B.1  | |
| [1] Republic of Belarus, Minsk, OCJC "Planar-SO"; | |
| 关键词: ultrasonic bond head; bonding force; current stabilization in wire coil; ultrasonic transducer; ultrasonic transducer mount; flat-parallel plates; | |
| DOI : 10.15222/TKEA2021.1-2.49 | |
| 来源: DOAJ | |
【 授权许可】
Unknown