Design of a Smart Ultrasonic Transducer for Interconnecting Machine Applications

Sensors

Tian-Hong Yan¹  Wei Wang¹  Xue-Dong Chen²  Qing Li¹ 

[1] College of Mechatronics Engineering, China Ji Liang University, Xueyuan Road, Xiasha University Park, Hangzhou 310018, China; E-Mails:;National Key Lab for Digital Manufacturing and Equipment Lab, Huazhong University of Science & Technology, Wuhan 430074, China; E-Mail:

关键词: ultrasonic transducer;    wire bonding;    axial / longitudinal vibration mode;   

DOI  :  10.3390/s90604986

来源: mdpi

【 摘 要 】

A high-frequency ultrasonic transducer for copper or gold wire bonding has been designed, analyzed, prototyped and tested. Modeling techniques were used in the design phase and a practical design procedure was established and used. The transducer was decomposed into its elementary components. For each component, an initial design was obtained with simulations using a finite elements model (FEM). Simulated ultrasonic modules were built and characterized experimentally through the Laser Doppler Vibrometer (LDV) and electrical resonance spectra. Compared with experimental data, the FEM could be iteratively adjusted and updated. Having achieved a remarkably highly-predictive FEM of the whole transducer, the design parameters could be tuned for the desired applications, then the transducer is fixed on the wire bonder with a complete holder clamping was calculated by the FEM. The approach to mount ultrasonic transducers on wire bonding machines also is of major importance for wire bonding in modern electronic packaging. The presented method can lead to obtaining a nearly complete decoupling clamper design of the transducer to the wire bonder.

【 授权许可】

CC BY   
© 2009 by the authors; licensee Molecular Diversity Preservation International, Basel, Switzerland.