Low Temperature Joining and High Temperature Application of Segmented Half Heusler/Skutterudite Thermoelectric Joints

Materials

Yefeng Bao¹  Yunfei Xing²  Ming Gu²  Weian Wang²  Xiaoya Li² 

[1] School of Mechanical and Electrical Engineering, Hohai University, Changzhou 213022, China;The State Key Lab of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China;

关键词: segmented thermoelectric joints;    joining process;    microstructure;    contact resistance;   

DOI  :  10.3390/ma13010155

来源: DOAJ

【 摘 要 】

A low temperature joining process has been developed to fabricate segmented half Heusler/skutterudite thermoelectric joints, and high temperature service behavior of the joints has been studied. The microstructure and electrical resistance across the joint before and after aging were investigated. The joint is well bonded and no cracks appear at the interfaces of the joint before and after aging, which can attribute to the formation of high melting point intermetallic compounds. The electrical resistance crosses the bonding layer smoothly and the contact resistance is low. These results show the process is effective, and promising for preparation of segmented thermoelectric devices.

【 授权许可】

Unknown