Surface Kinetic Mechanisms of Epitaxial Chemical Vapour Deposition of 4H Silicon Carbide Growth by Methyltrichlorosilane-H2 Gaseous System

Materials

Bing Gao¹  Botao Song¹  Yue Yu¹  Pengfei Han¹ 

[1] The Institute of Technological Sciences, Wuhan University, Wuhan 430072, China;

关键词: silicon carbide;    kinetic mechanism;    chemical vapour deposition;    numerical model;    MTS-H₂;   

DOI  :  10.3390/ma15113768

来源: DOAJ

【 摘 要 】

The chemical vapour deposition (CVD) technique could be used to fabricate a silicon carbide (SiC) epitaxial layer. Methyltrichlorosilane (CH₃SiCl₃, MTS) is widely used as a precursor for CVD of SiC with a wide range of allowable deposition temperatures. Typically, an appropriate model for the CVD process involves kinetic mechanisms of both gas-phase reactions and surface reactions. Here, we proposed the surface kinetic mechanisms of epitaxial SiC growth for MTS-H₂ gaseous system where the MTS employed as the single precursor diluted in H₂. The deposition face is assumed to be the Si face with a surface site terminated by an open site or H atom. The kinetic mechanisms for surface reactions proposed in this work for MTS-H₂ gaseous system of epitaxial growth of SiC by CVD technique from mechanisms proposed for H-Si-C-Cl system are discussed in detail. Predicted components of surface species and growth rates at different mechanisms are discussed in detail.

【 授权许可】

Unknown