Study on the grinding characteristics of sapphire with the assistant of cerium oxide liquid

Materials & Design

Tianfeng Zhou¹  Wen Shao²  Peng Guo²  Limin Zhu³  Peng Liu³  Long Zhang³  Xiangyuan Wang³ 

[1] Corresponding author.;Beijing Institute of Technology Chongqing Innovation Center, Chongqing 401120, China;State Key Laboratory of Mechanical System and Vibration, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China;

关键词: Grinding characteristics;    Assisted grinding;    Cerium oxide liquid;    Sapphire;   

DOI  :  

来源: DOAJ

【 摘 要 】

Due to its high hardness and brittleness, sapphire is difficult to obtain a low grinding roughness. In this paper, the cerium oxide liquid is used to assist the grinding of sapphire with a diamond wheel with relatively big-size grains to obtain a low roughness. The effects of grain size, the crystal orientation of the sapphire, and the pH values of the cerium oxide liquid on the assisted grinding process have been analyzed. It is shown that with the proposed method, the roughness of 45 nm and subsurface damage of 141 nm are obtained, respectively. Compared with the grinding surfaces obtained without the assistant, the roughnesses and the subsurface damage of the assisted grinding surfaces are reduced by 60.8% and 84.5% when #600 wheel is used, respectively. Moreover, in the grinding experiments, the crystal orientation of the sapphire and the pH values of the cerium oxide liquid have little effect on the roughness of the grinding surface, while the grain size has a great impact. It is concluded that the improvement of the surface roughness by using the proposed method benefits from the combined action of the grinding of grains and the polishing of the cerium oxide liquid.

【 授权许可】

Unknown