EFFECT ON MICROSTRUCTURAL AND PHYSICAL PROPERTIES OF Sn-3.0Ag-0.5Cu LEAD-FREE SOLDER WITH THE ADDITION OF SiC PARTICLES

European Journal of Materials Science and Engineering

Norainiza SAUD¹  Zawawi MAHIM¹  Mohd Arif Anuar MOHD SALLEH¹ 

[1] Centre of Excellence Geopolymer and Green Technology, School of Materials Engineering, Universiti Malaysia Perlis (UniMAP), Taman Muhibbah 02600, Jejawi, Arau, Perlis, Malaysia.;

关键词: powder metallurgy method;    sic;    microstructure;    microhardness;    sac lead-free solder;   

DOI  :  10.36868/ejmse.2019.04.01.037

来源: DOAJ

【 摘 要 】

The Lead-free solder has been subject of concentrated research activity over the past era, but it is hard to meet the characterization and mechanical properties of Sn-Pb solder. Sn-Ag-Cu and Sn-Cu family of alloys were the most ideal and capable among all the Pb-free solder alloys proposed. Much publicity had been received by the eutectic Sn-3.0Ag-0.5Cu and Sn0.7Cu solidifying their position as the most promising successor to Pb alloys solder. This study was to carry through the investigation of the effect of SiC particle on microstructure development and physical properties of Sn-3.0Ag-0.5Cu (SAC) based solder alloys. Powder metalurgy method (PM) was used to synthesize SAC-SiC composite solders, which involves some processes like mechanical blending, compaction and sintering. The outcome shows the additional of SiC particle has decreasing the β-Sn region and at the same time, the values of microhardness were increased.

【 授权许可】

Unknown