Improving the surface insulating performance of epoxy resin/Al(2)O(3) composite materials by extending chain of liquid epoxy resin with Me-THPA

High Voltage

Bin Du¹  Kerong Yang¹  Jinhui Bai¹  Yushun Zhao¹  Xuepei Wang¹  Yuanhan He¹ 

[1] School of Electrical Engineering and Automation, Hefei University of Technology;

关键词: resins;    curing;    bonds (chemical);    flashover;    filled polymers;    composite insulating materials;    alumina;    liquid epoxy resin;    basin-type insulators;    curing defects;    low curing exothermic rates;    curing stress;    chain-extended epoxy resin composite materials;    surface insulating performance;    epoxy resin-al(2)o(3) composite materials;    methyl tetrahydrophthalic anhydride;    molecular chain;    molecular weight distribution;    microstructures;    negative dc surface flashover characteristics;    functional groups;    surface flashover tests;    carbon-oxygen single bonds;    al(2)o(3);   

DOI  :  10.1049/hve.2019.0108

来源: DOAJ

【 摘 要 】

Basin-type insulators are made by epoxy resin composite materials. Curing defects are easily formed in basin-type insulators, and degrade their insulating performances. High curing exothermic rates of epoxy resin composite materials have deemed as the main cause of curing defects formation. In this study, methyl tetrahydrophthalic anhydride (Me-THPA) was used to extend the molecular chain of liquid epoxy resin to prepare epoxy resin composite materials with low curing exothermic rates. Curing exothermic properties, molecular weight distribution, curing stress, microstructures, and surface flashover characteristics of the composite materials were investigated. The results showed that chain-extended epoxy resin had low curing exothermic rates. The curing stress of the chain-extended epoxy resin composite materials was small. The curing defects forming in the composite materials were inhibited. Negative DC surface flashover characteristics of these composite materials were improved. Furthermore, variation of functional groups of the composite materials was studied before and after surface flashover tests. Results showed that the content of carbon–oxygen single bonds (–C–O) in the chain-extended epoxy resin composite materials was observed to decrease. The –C–O bonds also affect the voltage withstand capability of the epoxy resin composite materials.

【 授权许可】

Unknown