Study of the Effect of Curing Residual Stress on the Bonding Strength of the Single Lap Joint Using a High-Temperature Phosphate Adhesive

Materials

Chao Wang¹  Yan Gong²  Chengkun Ma³  Hui Qi³  Yuan Tian³  Jifeng Zhang³ 

[1] Institute of Petrochemistry, Heilongjiang Academy of Science, Harbin 150001, China;School of Materials Science and Engineering, Beijing Institute of Fashion Technology, Beijing 100029, China;Smart Structures and Advanced Composite Materials Lab, College of Aerospace and Civil Engineering, Harbin Engineering University, Harbin 150001, China;

关键词: phosphate adhesive;    residual stress;    bonding strength;    micro-Raman spectroscopy;    single lap joint;    DSC-TG analysis;   

DOI  :  10.3390/ma11071198

来源: DOAJ

【 摘 要 】

High-temperature phosphate adhesives are widely used in the aerospace and nuclear power industries. However, complex residual stresses can result when the curing temperature parameters are unreasonable due to the brittleness of the adhesive. To reveal the curing temperature mechanism affecting the bonding strength of the phosphate adhesives, several curing temperature curves (CT-1~6) were designed for the single lap joint (SLJ) using phosphate adhesive. The residual stress helped to reveal the relationship between the curing temperature parameters and the bonding performance. In this process, the residual stress of the silicon carbide joint was measured using micro-Raman spectroscopy, and the tensile strength of the joint was tested. A cohesive zone model (CZM) was established with Abaqus® to verify the results, and the numerical results from the model agreed well with the experimental values. The residual stress and adhesive strength were obviously affected by curing temperature. The reasonable curing temperature curves have the benefits of reducing the residual stress and improving the bonding strength.

【 授权许可】

Unknown