Rheologically Assisted Design of Conductive Adhesives for Stencil Printing on PCB

Materials

Isabel Delgado¹  Hugo Figueiredo¹  Maria C. Paiva²  Paulo E. Lopes²  Mariana M. Silva²  Ângelo D. M. Silva²  Loic Hilliou² 

[1] Bosch Car Multimedia Portugal SA (CM/MFT1), 4705-820 Braga, Portugal;Instituto de Polímeros e Compósitos (IPC), Universidade do Minho, 4804-533 Guimarães, Portugal;

关键词: solder paste;    electrically conductive adhesives;    carbon nanotubes;    exfoliated graphite;    stencil printing;    yield stress;   

DOI  :  10.3390/ma14247734

来源: DOAJ

【 摘 要 】

Driven by the need to deliver new, lead-free, eco-friendly solder pastes for soldering electronic components to Printed Circuit Boards (PCB), electrically conductive adhesives (ECAs) based on epoxy, carbon nanotubes (CNT), and exfoliated graphite (EG) were designed. The rheology of the adhesives prepared is paramount for the success of the deposition process, which is based on stencil printing. Thus, a rheological analysis of the process was first performed. Then, an experimental protocol was defined to assess the relevant viscoelastic characteristics of the adhesives for stencil printing application. Different composite formulations of epoxy/CNT/EG were produced. Their rheological characteristics were established following the designed protocol and benchmarked with a commercial solder paste. The thermal and electrical properties of the composite formulations were also characterized. As a result, a new, electrically conductive adhesive was delivered with potential to be an eco-friendly alternative to the solder paste currently used in stencil printing of PCB.

【 授权许可】

Unknown