Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components

Materials

Mohd Nizam Ab. Rahman¹  Noor Suhana Mohd Zubir²  Raden Achmad Chairdino Leuveano²  Jaharah A. Ghani²  Wan Mohd Faizal Wan Mahmood² 

[1] Faculty of Engineering & Built Environment, National University of Malaysia, Selangor, 43600 UKM, Bangi, Malaysia;

关键词: solder paste;    fine-pitch component;    dynamic characteristic;    thermal shock;    Taguchi method;    solder joint;   

DOI  :  10.3390/ma7127706

来源: mdpi

【 摘 要 】

The significant increase in metal costs has forced the electronics industry to provide new materials and methods to reduce costs, while maintaining customers’ high-quality expectations. This paper considers the problem of most electronic industries in reducing costly materials, by introducing a solder paste with alloy composition tin 98.3%, silver 0.3%, and copper 0.7%, used for the construction of the surface mount fine-pitch component on a Printing Wiring Board (PWB). The reliability of the solder joint between electronic components and PWB is evaluated through the dynamic characteristic test, thermal shock test, and Taguchi method after the printing process. After experimenting with the dynamic characteristic test and thermal shock test with 20 boards, the solder paste was still able to provide a high-quality solder joint. In particular, the Taguchi method is used to determine the optimal control parameters and noise factors of the Solder Printer (SP) machine, that affects solder volume and solder height. The control parameters include table separation distance, squeegee speed, squeegee pressure, and table speed of the SP machine. The result shows that the most significant parameter for the solder volume is squeegee pressure (2.0 mm), and the solder height is the table speed of the SP machine (2.5 mm/s).

【 授权许可】

CC BY   
© 2014 by the authors; licensee MDPI, Basel, Switzerland.