Interfacial reactions in thermoelectric modules

Materials Research Letters

Pai-chun Wei¹  Albert T. Wu²  Hsin-jay Wu³  Sinn-wen Chen⁴ 

[1] King Abdullah University of Science and Technology (KAUST);National Central University;National Sun Yat-sen University;National Tsing Hua University;

关键词: Thermoelectric (TE) material and module;    interfacial reaction;    Bi2Te3;    PbTe;   

DOI  :  10.1080/21663831.2018.1436092

来源: DOAJ

【 摘 要 】

Engineering transport properties of thermoelectric (TE) materials leads to incessantly breakthroughs in the zT values. Nevertheless, modular design holds a key factor to advance the TE technology. Herein, we discuss the structures of TE module and illustrate the inter-diffusions across the interface of constituent layers. For Bi2Te3-based module, soldering is the primary bonding method, giving rise to the investigations on the selections of solder, diffusion barrier layer and electrode. For mid-temperature PbTe-based TE module, hot-pressing or spark plasma sintering are alternative bonding approaches; the inter-diffusions between the diffusion barrier layer, electrode and TE substrate are addressed as well.

【 授权许可】

Unknown