Laser Erasing and Rewriting of Flexible Copper Circuits

Nano-Micro Letters

Peng Peng¹  Xingwen Zhou²  Wei Guo² 

[1] Department of Mechanical and Mechatronics Engineering, Centre for Advanced Materials Joining, University of Waterloo, N2L 3G1, Waterloo, ON, Canada;School of Mechanical Engineering and Automation, Beihang University, 100191, Beijing, People’s Republic of China;

关键词: Laser writing;    Laser erasing;    Copper electrodes;    Electronic repairing;    Flexible electronics;   

DOI  :  10.1007/s40820-021-00714-3

来源: Springer

【 摘 要 】

tsAn up-bottom laser erasing process utilizing electrochemical corrosion has been integrated into the bottom-up writing process.The presented erased laser writing technology exhibits excellent reproducibility for sustainable manufacturing of flexible highly conductive Cu structure.The suitability of the writing-erasing-rewriting process for repairing failure patterns and reconfiguring circuits has been demonstrated.

【 授权许可】

CC BY