期刊论文详细信息
Nano-Micro Letters | |
Laser Erasing and Rewriting of Flexible Copper Circuits | |
Peng Peng1  Xingwen Zhou2  Wei Guo2  | |
[1] Department of Mechanical and Mechatronics Engineering, Centre for Advanced Materials Joining, University of Waterloo, N2L 3G1, Waterloo, ON, Canada;School of Mechanical Engineering and Automation, Beihang University, 100191, Beijing, People’s Republic of China; | |
关键词: Laser writing; Laser erasing; Copper electrodes; Electronic repairing; Flexible electronics; | |
DOI : 10.1007/s40820-021-00714-3 | |
来源: Springer | |
【 摘 要 】
tsAn up-bottom laser erasing process utilizing electrochemical corrosion has been integrated into the bottom-up writing process.The presented erased laser writing technology exhibits excellent reproducibility for sustainable manufacturing of flexible highly conductive Cu structure.The suitability of the writing-erasing-rewriting process for repairing failure patterns and reconfiguring circuits has been demonstrated.
【 授权许可】
CC BY
【 预 览 】
Files | Size | Format | View |
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RO202203043331803ZK.pdf | 3136KB | download |