期刊论文详细信息
| Chinese Journal of Mechanical Engineering | |
| Coupling Modeling for Functional Surface of Electronic Equipment | |
| Baoyan DUAN1  Wei WANG1  Congsi WANG1  | |
| [1] Key Laboratory of Electronic Equipment Structure Design of Ministry of Education, Xidian University, 710071, Xi’an, China; | |
| 关键词: Functional Surface; Electronic Equipment; Electromechanical Coupling; Electrical Performance; Mutual Coupling; | |
| DOI : 10.1007/s10033-017-0125-1 | |
| 来源: Springer | |
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