【 摘 要 】
Recently, electroplated cobalt platinum (CoPt) magnetic films have been developed that afford thick (up to ∼100 μm), high-energy-density (up to ∼100 kJ/m 3 ) permanent-magnet microstructures. However, the aggressive electroplating conditions have shown to be incompatible with most thick-film photoresist mould materials, making patterning these films an unanswered technical challenge. In this work, it is reported a complete process flow of fabricating and removing SU-8 photoresist moulds to enable the ultra-thick patterned CoPt magnets on silicon wafers. The implementation of thick SU-8 2050 electroplating moulds makes it feasible to deposit 100 µm thick CoPt magnets in 4 h. A 25 nm thick sputtered titanium layer is used as a sacrificial layer to completely release the SU-8 mould in hydrofluoric acid after electrodeposition. Compared to prior research, significantly improved pattern definition and constant magnetic performance are observed and characterised by optical profilometer, scanning electron microscope, and vibrating sample magnetometer.
【 授权许可】
CC BY|CC BY-ND|CC BY-NC|CC BY-NC-ND
【 预 览 】
| Files | Size | Format | View |
|---|---|---|---|
| RO202107100002636ZK.pdf | 358KB |
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