Electrochemical behavior of carbon steel pre-treated with an organo functional bis-silane filled with copper phthalocyanine

Journal of the Brazilian Chemical Society

Patricia H. Suegama¹  Idalina V. Aoki¹ 

[1] ,Universidade de São Paulo Escola Politécnica Departamento de Engenharia QuímicaSão Paulo SP ,Brazil

关键词: corrosion;    silane film;    BTSPA;    inhibitor;   

DOI  :  10.1590/S0103-50532008000400019

来源: SciELO

【 摘 要 】

The bis-[trimethoxysilylpropyl]amine (BTSPA) film filled with copper phthalocyanine (Cu-Ph) was prepared by adding different concentrations of copper phthalocyanine - Cu-Ph and deposited on a carbon steel substrate using 120 ºC and 150 ºC as curing temperatures. For samples cured at 150 ºC a second layer was also deposited. The electrochemical behavior of carbon steel coated with BTSPA filled with Cu-Ph was studied by electrochemical measurements, electrochemical impedance spectroscopy (EIS) and polarization curves, in aerated 0.1 mol L-1 NaCl solution. Physical and chemical characterization was made by thermogravimetric analysis (TGA), scanning electron microscopy, contact angle measurements and infrared spectroscopy. TGA showed no decomposition of Cu-Ph during the curing process. Cu-Ph added into the silane film showed a strong influence on its corrosion resistance, mainly when the samples are cured at 150 ºC. The results showed that lower inhibitor concentrations led to a higher corrosion resistance and the second layer increased by one order of magnitude the corrosion resistance.

【 授权许可】

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