Journal of the Brazilian Chemical Society | |
Electrochemical behavior of carbon steel pre-treated with an organo functional bis-silane filled with copper phthalocyanine | |
Aoki, Idalina V.1  Suegama, Patricia H.1  Universidade de São Paulo, São Paulo, Brazil1  | |
关键词: corrosion; silane film; BTSPA; inhibitor; | |
DOI : 10.1590/S0103-50532008000400019 | |
学科分类:化学(综合) | |
来源: SciELO | |
【 摘 要 】
The bis-[trimethoxysilylpropyl]amine (BTSPA) film filled with copper phthalocyanine (Cu-Ph) was prepared by adding different concentrations of copper phthalocyanine Cu-Ph and deposited on a carbon steel substrate using 120 ºC and 150 ºC as curing temperatures. For samples cured at 150 ºC a second layer was also deposited. The electrochemical behavior of carbon steel coated with BTSPA filled with Cu-Ph was studied by electrochemical measurements, electrochemical impedance spectroscopy (EIS) and polarization curves, in aerated 0.1 mol L-1 NaCl solution. Physical and chemical characterization was made by thermogravimetric analysis (TGA), scanning electron microscopy, contact angle measurements and infrared spectroscopy. TGA showed no decomposition of Cu-Ph during the curing process. Cu-Ph added into the silane film showed a strong influence on its corrosion resistance, mainly when the samples are cured at 150 ºC. The results showed that lower inhibitor concentrations led to a higher corrosion resistance and the second layer increased by one order of magnitude the corrosion resistance.
【 授权许可】
Unknown
【 预 览 】
Files | Size | Format | View |
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RO201912050580419ZK.pdf | 942KB | download |