Integrated Inductors for RF Transmitters in CMOS/MEMS Smart Microsensor Systems

Sensors

Jong-Wan Kim¹  Hidekuni Takao¹  Kazuaki Sawada¹ 

[1] Department of Electrical and Electronic Engineering, Toyohashi University of Technology, Toyohashi/Aichi, 441-8580, Japan

关键词: Bonding wire inductor;    RF transmitter;    CMOS/MEMS;    CMOS compatible process;   

DOI  :  10.3390/s7081387

来源: mdpi

【 摘 要 】

This paper presents the integration of an inductor by complementary metal-oxide-semiconductor (CMOS) compatible processes for integrated smart microsensor systems that have been developed to monitor the motion and vital signs of humans in various environments. Integration of radio frequency transmitter (RF) technology with complementary metal-oxide-semiconductor/micro electro mechanical systems (CMOS/MEMS) microsensors is required to realize the wireless smart microsensors system. The essential RF components such as a voltage controlled RF-CMOS oscillator (VCO), spiral inductors for an LC resonator and an integrated antenna have been fabricated and evaluated experimentally. The fabricated RF transmitter and integrated antenna were packaged with subminiature series A (SMA) connectors, respectively. For the impedance (50 Ω) matching, a bonding wire type inductor was developed. In this paper, the design and fabrication of the bonding wire inductor for impedance matching is described. Integrated techniques for the RF transmitter by CMOS compatible processes have been successfully developed. After matching by inserting the bonding wire inductor between the on-chip integrated antenna and the VCO output, the measured emission power at distance of 5 m from RF transmitter was -37 dBm (0.2 μW).

【 授权许可】

Unknown   
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