Implementation of the CMOS MEMS Condenser Microphone with Corrugated Metal Diaphragm and Silicon Back-Plate

Sensors

Chien-Hsin Huang²  Chien-Hsing Lee¹  Tsung-Min Hsieh¹  Li-Chi Tsao¹  Shaoyi Wu¹  Jhyy-Cheng Liou¹  Ming-Yi Wang³  Li-Che Chen³  Ming-Chuen Yip² 

[1] Department of Device Development, Solid State System Corporation (3S), Hsinchu 30288, Taiwan; E-Mails:;Department of Power Mechanical Engineering, National Tsing Hua University (NTHU), Hsinchu 30013, Taiwan; E-Mails:;Department of Microelectromechanical Systems, United Microelectronics Corporation (UMC), Hsinchu 30078, Taiwan; E-Mails:

关键词: CMOS-MEMS;    condenser microphone;    corrugated;    sensitivity;    diaphragm;   

DOI  :  10.3390/s110606257

来源: mdpi

【 摘 要 】

This study reports a CMOS-MEMS condenser microphone implemented using the standard thin film stacking of 0.35 μm UMC CMOS 3.3/5.0 V logic process, and followed by post-CMOS micromachining steps without introducing any special materials. The corrugated diaphragm for the microphone is designed and implemented using the metal layer to reduce the influence of thin film residual stresses. Moreover, a silicon substrate is employed to increase the stiffness of the back-plate. Measurements show the sensitivity of microphone is −42 ± 3 dBV/Pa at 1 kHz (the reference sound-level is 94 dB) under 6 V pumping voltage, the frequency response is 100 Hz–10 kHz, and the S/N ratio >55 dB. It also has low power consumption of less than 200 μA, and low distortion of less than 1% (referred to 100 dB).

【 授权许可】

CC BY   
© 2011 by the authors; licensee MDPI, Basel, Switzerland.