Electronics | |
Beyond the Interconnections: Split Manufacturing in RF Designs | |
Yu Bi1  Jiann S. Yuan2  Yier Jin2  | |
[1] Department of Electrical Engineering and Computer Science, University of Central Florida, 4000 Central Florida Blvd, Orlando, FL 32816, USA; | |
关键词: hardware trust; IP piracy; power amplifier; RF circuit; split manufacturing; | |
DOI : 10.3390/electronics4030541 | |
来源: mdpi | |
【 摘 要 】
With the globalization of the integrated circuit (IC) design flow of chip fabrication, intellectual property (IP) piracy is becoming the main security threat. While most of the protection methods are dedicated for digital circuits, we are trying to protect radio-frequency (RF) designs. For the first time, we applied the split manufacturing method in RF circuit protection. Three different implementation cases are introduced for security and design overhead tradeoffs,
【 授权许可】
CC BY
© 2015 by the authors; licensee MDPI, Basel, Switzerland.
【 预 览 】
Files | Size | Format | View |
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RO202003190007648ZK.pdf | 1577KB | download |