Flip Chip Bonding of a Quartz MEMS-Based Vibrating Beam Accelerometer

Sensors

Jinxing Liang³  Liyuan Zhang³  Ling Wang²  Yuan Dong³  Toshitsugu Ueda¹ 

[1] Graduate School of Information, Production and Systems, Waseda University, Kitakyushu 808-0135, Japan; E-Mail:;School of Automation, Southeast University, Nanjing 210096, China; E-Mail:;Key Laboratory of Micro-Inertial Instrument and Advanced Navigation Technology, Ministry of Education, School of Instrument Science and Engineering, Southeast University, Nanjing 210096, China; E-Mails:

关键词: quartz MEMS;    vibrating beam accelerometer;    flip chip bonding;    self-alignment;    double ended tuning fork;   

DOI  :  10.3390/s150922049

来源: mdpi

【 摘 要 】

In this study, a novel method to assemble a micro-accelerometer by a flip chip bonding technique is proposed and demonstrated. Both the main two parts of the accelerometer, a double-ended tuning fork and a base-proof mass structure, are fabricated using a quartz wet etching process on Z cut quartz wafers with a thickness of 100 μm and 300 μm, respectively. The finite element method is used to simulate the vibration mode and optimize the sensing element structure. Taking advantage of self-alignment function of the flip chip bonding process, the two parts were precisely bonded at the desired joint position via AuSn solder. Experimental demonstrations were performed on a maximum scale of 4 × 8mm² chip, and high sensitivity up to 9.55 Hz/g with a DETF resonator and a Q value of 5000 in air was achieved.

【 授权许可】

CC BY   
© 2015 by the authors; licensee MDPI, Basel, Switzerland.