Thermal Curing Property of Silicone Encapsulant Containing Quantum Dot Surrounded by Various Types of Ligands

Bulletin of the Korean chemical society

Sung-Kyu Hong¹  Chae Sung Lee¹  BeomJong Kim¹  Cheul Jong Han¹  Seongun Jeon¹ 

关键词: Quantum dot;    Silicone encapsulant;    Ligand;    Thermal curing degree;    TOPO;   

DOI  :  

学科分类：化学（综合）

来源: Korean Chemical Society

【 摘 要 】

In this study, the silicone thermal curing degree of the silicone-encapsulated quantum dot light emission diode was measured using the various types of chemical ligands around quantum dot. It was confirmed that the trioctyl phosphin oxide (TOPO) ligand around the quantum dot was responsible for dispersion of the quantum dot in silicone encapsulant and decline of the thermal curing degree of the silicone encapsulant. Also, it was confirmed that the thermal curing degree of silicone encapsulants containing the steric acid (SA) and the dodecanoic acid (DA) ligands were higher than the one of TOPO ligand.

【 授权许可】

Unknown