Reduction in thermal conductivity of Bi�?�Te alloys through grain refinement method

Bulletin of materials science

Soma Dutta¹  T G Ramesh¹  V Shubha¹ 

[1] Materials Science Division, National Aerospace Laboratories, PO Box 1779, Kodihalli, Bangalore 560 017, India$$Materials Science Division, National Aerospace Laboratories, PO Box 1779, Kodihalli, Bangalore 560 017, IndiaMaterials Science Division, National Aerospace Laboratories, PO Box 1779, Kodihalli, Bangalore 560 017, India$$

关键词: Bismuth telluride;    mechanical alloying;    grain boundary;    thermal conductivity.;   

DOI  :  

学科分类：材料工程

来源: Indian Academy of Sciences

【 摘 要 】

Ternary alloys of thermoelectric materials Biâ€�?�Sbâ€�?�Te and Biâ€�?�Seâ€�?�Te of molecular formula, Bi_0.5Sb_1.5Te₃ (ð‘�? type) and Bi_0.36Se_0.064Te_0.576 (ð‘�?? type), were prepared by mechanical alloying method. The preparation of materials by mechanical alloying method has effectively reduced the thermal conductivity by generating a large number of induced grain boundaries with required degree of disorder. The process of frequent milling was adapted for grain refinement. Substantial reduction in thermal conductivity was achieved due to nano-structuring of these alloys. Thermal conductivity values were found to be very low at room temperature, 0.5W/mK and 0.8W/mK, respectively for p and n type materials.

【 授权许可】

Unknown