Kinetic Study of the Effect of Selected Surfactants on Corrosion of Copper | Science Publications

American Journal of Applied Sciences

Howaida M. El-Kashlan¹ 

关键词: corrosion;    surface active substance;    ammonium salts;    mass transfer in electrolysis;   

DOI  :  10.3844/ajassp.2008.347.354

学科分类：自然科学（综合）

来源: Science Publications

【 摘 要 】

The rates of copper corrosion were determined by measuring the limiting current of anodic dissolution of copper in phosphoric acid in presence and in absence of cetyl trimethyl ammonium bromide (CTAB) and cetyl pyridinium bromide (CPYB). The rate of corrosion is found to decrease by increasing the concentration of the surfactant. The percentage of inhibition ranged from 1.85 to 33.97% depending on the type of surfactant and its concentration. Increasing the copper electrode height, and concentration of H3PO4 decreases the rate of copper corrosion. The investigated adsorption isotherms indicate that the two surfactants fit Langmuir and Flory Huggins isotherm. The thermodynamic parameters show that corrosion is a diffusion controlled process. The dimensional analysis method was used to obtain the overall mass transfer correlations under the study conditions.

【 授权许可】

Unknown