期刊论文详细信息
IEICE Electronics Express | |
Chip-to-chip interconnect integration technologies | |
Muhannad Bakir1  Li Zheng1  Muneeb Zia1  Chaoqi Zhang1  Hyun Suk Yang1  | |
[1] Georgia Institute of Technology | |
关键词: interconnect; nanophotonic integration; flexible interconnects; heterogeneous integration; | |
DOI : 10.1587/elex.13.20162001 | |
学科分类:电子、光学、磁材料 | |
来源: Denshi Jouhou Tsuushin Gakkai | |
【 摘 要 】
References(28)With continuous increase in the off-chip bandwidth requirements, conventional interconnection methodologies are quickly becoming incapable of meeting the demand. Recent progress in silicon interposer and 3D integration technologies seek to alleviate some of these bottlenecks. This paper reviews the evolution of conventional interconnect methodologies and recent progress in platforms allowing high-bandwidth low-energy chip-to-chip communication.
【 授权许可】
Unknown
【 预 览 】
Files | Size | Format | View |
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RO201911300809045ZK.pdf | 183KB | download |