Chip-to-chip interconnect integration technologies

IEICE Electronics Express

Muhannad Bakir¹  Li Zheng¹  Muneeb Zia¹  Chaoqi Zhang¹  Hyun Suk Yang¹ 

[1] Georgia Institute of Technology

关键词: interconnect;    nanophotonic integration;    flexible interconnects;    heterogeneous integration;   

DOI  :  10.1587/elex.13.20162001

学科分类：电子、光学、磁材料

来源: Denshi Jouhou Tsuushin Gakkai

【 摘 要 】

References(28)With continuous increase in the off-chip bandwidth requirements, conventional interconnection methodologies are quickly becoming incapable of meeting the demand. Recent progress in silicon interposer and 3D integration technologies seek to alleviate some of these bottlenecks. This paper reviews the evolution of conventional interconnect methodologies and recent progress in platforms allowing high-bandwidth low-energy chip-to-chip communication.

【 授权许可】

Unknown