Optimization of flip-chip transitions for 60-GHz packages

IEICE Electronics Express

Dong Gun Kam¹ 

[1] Ajou University

关键词: 60-GHz packages;    flip-chip transitions;    design optimization;    signal integrity;   

DOI  :  10.1587/elex.11.20140256

学科分类：电子、光学、磁材料

来源: Denshi Jouhou Tsuushin Gakkai

【 摘 要 】

References(6)Although flip-chip transitions have smaller parasitics than bonding wires, they should be carefully designed at 60 GHz. Insertion loss at a flip-chip transition may differ as much as 2 dB depending on design parameters. In this paper we present a comprehensive sensitivity analysis to optimize the flip-chip transition.

【 授权许可】

Unknown