Comparative Study of Different Underfill Material on Flip Chip Ceramic Ball Grid Array Based on Accelerated Thermal Cycling | Science Publications

American Journal of Engineering and Applied Sciences

R. Rasid¹  Z. Kornain¹  A. Jalar¹  N. Amin¹  C. S. Foong¹ 

关键词: Ceramic;    FC-CBGA;    FEA;    reliability thermo-mechanical;    stress;   

DOI  :  10.3844/ajeassp.2010.83.89

学科分类：工程和技术（综合）

来源: Science Publications

【 摘 要 】

Problem statement:This study mainly to study the effect of several commercial underfill materials to the reliability of HiCTE Flip Chip Ceramic Ball Grid Array (FC-CBGA) package due to Accelerated Thermal Cycling (ATC) effect. Approach: The warpage condition of package, die back stress, interfacial die shear stress, and solder bump fatigue for different commercial underfills were assessed and compared via a commercial Finite Element Analysis (FEA) under JEDEC Standard of ATC. The thermo-mechanical properties of underfills for simulation were obtained by using Thermal Mechanical Analyzer (TMA) and Dynamic Mechanical Analyzer (DMA). The actual package of HiCTE FC-CBGA were assembled with those underfill materials and underwent ATC to be compared with FEA result. Results: The results from FEA and experimental were discussed to characterize the performance of each underfill material. The results of this study indicate that the underfill materials investigated, those with a glass transition temperature (Tg) and a Young

【 授权许可】

Unknown