A thin film thermoelectric cooler for Chip-on-Board assembly

IEICE Electronics Express

Shiho Kim¹  Hyunju Lee¹  Namjae Kim¹  Jungho Yoo¹ 

[1] Dept. of Electrical Engineering, Chungbuk National University

关键词: thermoelectric cooler;    Chip-on-Board cooling;    PWM Driver of TEC;   

DOI  :  10.1587/elex.7.1615

学科分类：电子、光学、磁材料

来源: Denshi Jouhou Tsuushin Gakkai

【 摘 要 】

References(7)Cited-By(3)We have proposed and demonstrated an embedded thin film thermoelectric cooler attached between die chip and metal plate for Chip-on-Board (COB) direct assembly. The proposed structure of COB cooler was modeled by electrical equivalent circuit for SPICE simulation including operational heat generation of chip and PWM control of input power supply. The optimum input power of the TEC to achieve maximum temperature difference between chip and heat sink was simulated by using the proposed equivalent circuit. The measured and simulated results offer the possibility of thin film active cooling for COB direct assembly.

【 授权许可】

Unknown