Wafer-Scale Integration for Semi-Flexible Neural Implant Miniaturization

Proceedings

Van Zeijl, Henk¹  Kluba, Marta²  Morana, Bruno³  , Angel⁴  Pandraud, Gregory⁵ 

[1] Author to whom correspondence should be addressed.;Department of Microfabrication, Delft University of Technology, 2628CD Delft, The Netherlands;Else Kooi Laboratory (EKL), 2628CD Delft, The Netherlands;Philips Research–System in Package Devices, 5656AE Eindhoven, The Netherlands;Presented at the Eurosensors 2018 Conference, Graz, Austria, 9–12 September 2018

关键词: electroceuticals;    implantables;    miniaturization;    integration;    flexible interconnect;    DRIE;   

DOI  :  10.3390/proceedings2130941

学科分类：社会科学、人文和艺术（综合）

来源: mdpi

【 摘 要 】

We present a novel, wafer-based fabrication process that enables integration and assembly of electronic components, such as ASICs and decoupling capacitors, with flexible interconnects. The electronic components are fabricated in, or placed on precisely defined and closely-spaced silicon islands that are connected by interconnects embedded in parylene-based flexible thin film. This fully CMOS compatible approach uses optimized DRIE processes and an SiO2 mesh-shaped mask, allowing for the simultaneous definition of micrometer- to millimeter-sized structures without compromising the flexibility of the device. In a single fabrication flow a unique freedom in dimensions of both the flexible film and the silicon islands can be achieved making this new technique ideal for the realization of semi-flexible/foldable implantable devices, where structures of different sizes have to be combined together for the ultimate miniaturization.

【 授权许可】

CC BY