Evaluation of the temperature stability of a Cu/Ni multilayer

Archives of Metallurgy and Materials

关键词: Keywords:: Cu/Ni multilayers;    thermal stability;    X-ray diffraction;    texture;    atomic force microscopy;   

DOI  :  10.2478/v10172-012-0072-x

学科分类：金属与冶金

来源: Akademia Gorniczo-Hutnicza im. Stanislawa Staszica / University of Mining and Metallurgy

【 摘 要 】

The article presents investigation results for a Cu/Ni multilayer as annealed in the temperature range of 40÷300°C. The Cu/Ni multilayer with a Cu sublayer thickness of 2 nm and an Ni sublayer thickness of 6 nm was fabricated by the magnetron deposition technique. The X-ray structural analysis, XRD, was employed for examination. The characterization of the multilayer before and after the annealing process was done by the measurement of the texture for the Cu/Ni(111) plane, as well as by topography examination on an atomic force microscope (AFM). The state of the multilayer surface were observed using a scanning electron microscope.

【 授权许可】

Unknown