期刊论文详细信息
ETRI Journal
Circuit Modeling of Interdigitated Capacitors Fabricated by High-K LTCC Sheets
关键词: circuit model;    PEEC;    embedded passives;    LTCC;   
Others  :  1185439
DOI  :  10.4218/etrij.06.0105.0141
PDF
【 摘 要 】

The circuit modeling of interdigitated capacitors fabricated by high-k low-temperature co-fired ceramic (LTCC) sheets was investigated. The s-parameters of each test structure were measured from 50 MHz to 10 GHz, and the modeling was performed using these measured s-parameters up to the first resonant frequency. Each test structure was divided into appropriate building blocks.The equivalent circuit of each building block was composed based on the partial element equivalent circuit (PEEC) method. Modeling was executed to optimize the parameters in the equivalent circuit of each building block. The validity of the extracted parameters was verified by the predictive modeling for the test structures with different geometry. After that, Monte Carlo analysis and sensitivity analysis were performed based on the extracted parameters. The modeling methodology can allow a device designer to improve the yield and to save time and cost for the design and manufacturing of devices.

【 授权许可】

   

【 预 览 】
附件列表
Files Size Format View
20150520111138796.pdf 909KB PDF download
【 参考文献 】
  • [1]A. Reyes, S. El-Ghazaly, S. Dorn, M. Dydyk, D. Schroder, and H. Patterson, "Coplanar Waveguides and Microwave Inductors on Silicon Substrate," IEEE Trans. on Microwave Theory and Techniques, vol. 43, Sept. 1995, pp. 2016-2022.
  • [2]H. Hirano, K. Nishikawa, I. Toyoda, S. Aoyama, S. Sugitani, and K. Yamasaki, "Three-Dimensional Passive Circuit Technology for Ultra Compact MMICs," IEEE Trans. on Microwave Theory and Techniques, vol. 43, Dec. 1995, pp. 2845-2850.
  • [3]K. Mayaram, D.C. Lee, S. Moinian, D.A. Rich, and J. Roychowdhury, "Computer-Aided Circuit Analysis Tools for RFIC Simulation: Algorithms, Features, and Limitations," IEEE Trans. on Circuits and Systems II: Analog and Digital Signal Processing, vol. 47, i
  • [4]C. Kermarrec, G. Dawe, T. Tewksbury, and T. Brown, "The Future of RFIC Transceiver Technology," IEEE Radio Frequency Integrated Circuits (RFIC) Symp., June 1997, pp. 65-68.
  • [5]L. Golonka, K. Wolter, A. Dziedzic, J. Kita, and L. Rebenklau, "Embedded Passive Components for MCM," 24th Int’l Spring Seminar on Electronic Technology, May 2001, pp. 73-77.
  • [6]Y. Rao, J. Qu, and C.P. Wong, "RF Electrical Simulation of Embedded Capacitor," 2001 Int’l Symp. on Advanced Packaging Materials, 2001, pp. 286-292.
  • [7]R. Poddar, E.M. Moon, M.A. Brooke, and N.M. Jokerst, "Accurate, Rapid, High Frequency Empirically Based Predictive Modeling of Arbitrary Geometry Planar Resistive Passive Devices," IEEE Trans. on Components, Packaging, and Manufacturing Technology, Part
  • [8]I. Yun, R. Poddar, L. Carastro, M. Brooke, and G.S. May, "Statistical Modeling of 3-D Parallel-Plate Embedded Capacitors Using Monte Carlo Simulation," ETRI J., vol. 23, no. 1, Mar. 2001, pp. 23-32.
  • [9]I. Yun, L.A.Carastro, R. Poddar, M.A. Brooke, G.S. May, K. Hyun, and K.E. Pyun, "Extraction of Passive Device Model Parameters Using Genetic Algorithms," ETRI J, vol. 22, no. 1, Mar. 2000, pp. 38-46.
  • [10]Q.J. Zhang, M.C.E. Yagoub, X. Ding, D. Goulette, R. Sheffield, and H. Feyzbakhsh, "Fast and Accurate Modeling of Embedded Passives in Multi-Layer Printed Circuits Using Neural Network Approach," 2002 Electronic Components and Technology Conf., 2002, pp.
  • [11]K.L. Choi and M. Swaminathan, "Development of Model Libraries for Embedded Passives Using Network Synthesis," IEEE Trans. on Circuits and Systems II, vol. 47, no. 4, Apr. 2000, pp. 249-260.
  • [12]J. Hong and M.J. Lancaster, Microstrip Filters for RF/Microwave Applications, John Wiley & Sons, Inc., 2001.
  • [13]K. Kim, C. Oh, J. Chang, G. Han, and I. Yun, "Modeling of Octagonal Spiral Inductors for Integrated Circuit Applications," The 2004 Int’l Meeting for Future of Electron Devices, Kansai, July 2004, pp. 113-114.
  • [14]Avanti Software, Star-Hspice Manual, June 2001.
  文献评价指标  
  下载次数:9次 浏览次数:17次