会议论文详细信息
2018 3rd International Conference on Insulating Materials, Material Application and Electrical Engineering
Finite Element Simulation Analysis of Diamond Bi-directional Coining Neck Hole Forming Process
材料科学;无线电电子学;电工学
Shi, Guangfeng^1 ; Zhu, Guizhan^1
College of Electro-Mechanical Engineering, Changchun University of Science and Technology, Chang Chun, China^1
关键词: Bi-directional;    Diamond indenter;    Finite element simulations;    Hole-forming process;    Micro-scale effects;    Pore formation;    Technological parameters;    Two directions;   
Others  :  https://iopscience.iop.org/article/10.1088/1757-899X/452/2/022093/pdf
DOI  :  10.1088/1757-899X/452/2/022093
学科分类:材料科学(综合)
来源: IOP
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【 摘 要 】

A new method of Necking Hole Forming (NHF) is proposed in this paper, which coining metal sheet in two directions by micro-scale effects of the blunt circle at the edge of the diamond. It has an important application value in the industry. For the complexity of NHF forming process, start with technological parameters of the diamond indenter and coining model, deform-3d is used to analyze the plastic flow law inside the material and the pore formation. NHF process is studied from three aspects which are material flow, stress distribution, and load curve. The results show that uses of a small cone angle indenter are beneficial to the formation of NHF and good surface quality could be obtained; The upper and lower indenter cone angle is different, there is a sudden change in the axial force of the copper sheet when the hole is formed, which is used as a basis for monitoring micro-pore formed.

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